Metamatrial based packaging method for improved isolation of circuit elements in microwave modules

In this work, periodic structure has been used to design a new type of packaging technique to improve the isolation between microwave components within a module. In contrast to the conventional packaging technique, the new technique relaxes the requirement for using vias in the substrate and using conductive adhesive or gasket material within a typical multiple compartment microwave modules. On the other hand it uses a periodic structure of metal pins to form a lid for the microwave module. The achieved level of isolation in X-band and Ku-band for a two compartment test circuit is better than 65 dB which is better than the existing packaging technique within the band of interest.