• DocumentCode
    59679
  • Title

    Accurate Characterization of Attenuation Constants of Substrate Integrated Waveguide Using Resonator Method

  • Author

    Xi-Cheng Zhu ; Wei Hong ; Ke Wu ; Kuang-Da Wang ; Lin-Sheng Li ; Zhang-Cheng Hao ; Hong-Jun Tang ; Ji-Xin Chen

  • Author_Institution
    State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
  • Volume
    23
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    677
  • Lastpage
    679
  • Abstract
    A novel resonator method is presented to extract the attenuation constants of the substrate integrated waveguide (SIW) transmission lines, providing an alternative way to investigate the propagation properties of SIW. The losses of SIW transmission line and cavity resonator have been investigated with theoretical analysis. Then a formula is derived for establishing the relationship between the attenuation constant of the SIW transmission line and the unloaded Q-factor of SIW cavity resonator at its resonant frequency. Thus, the attenuation constant of SIW transmission line can be extracted using SIW cavity resonator. Good agreement between the resonator method and Thru-Line (TL) method has been achieved in both full-wave simulation and experimental results. Besides, good robustness of the resonator method has been demonstrated, suggesting it is a promising technique for investigation of the propagation properties of SIW.
  • Keywords
    cavity resonators; electromagnetic wave propagation; electromagnetic wave scattering; substrate integrated waveguides; transmission lines; Q-factor; SIW cavity resonator; SIW transmission lines; attenuation constants; substrate integrated waveguide; thru-line method; Cavity resonators; Dielectric losses; Power transmission lines; Propagation losses; Resonant frequency; Substrates; Transmission line measurements; Attenuation constant; propagation properties; substrate integrated waveguide (SIW) cavity resonator;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2013.2283870
  • Filename
    6637127