A system-proof-of-concept for remote measurement applications

Author

Mailand, M. ; Getzlaff, S. ; DeHennis, A.

Author_Institution

ZMDI, Zentrum Mikroelektron. Dresden AG, Dresden, Germany

fYear

2012

fDate

9-12 Dec. 2012

Firstpage

133

Lastpage

136

Abstract

This paper presents the chip level architecture and characterization results for a near field communication (NFC) ASIC that enables a new level of integration for remotely powered, wireless sensors. The multi-sensor input IC has the capability to measure temperature, voltage, current as well as light levels through two integrated photo-detectors. The variety of transducer inputs make it a suitable candidate for numerous sensing applications. This paper presents the bench level tests that have been run on packaged die that characterize its application performance for measuring glucose through its optical front end.

Keywords

electric current measurement; photodetectors; sugar; system-on-chip; temperature measurement; voltage measurement; ASIC; application performance; bench level tests; chip level architecture; current measurement; glucose measurement; integrated photo-detectors; light levels; multisensor input IC; near field communication; optical front end; packaged die; remote measurement applications; remotely powered wireless sensors; sensing applications; temperature measurement; transducer inputs; voltage measurement; Current measurement; Light emitting diodes; Optical variables measurement; Temperature measurement; Temperature sensors; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics, Circuits and Systems (ICECS), 2012 19th IEEE International Conference on

Conference_Location

Seville

Print_ISBN

978-1-4673-1261-5

Electronic_ISBN

978-1-4673-1259-2

Type

conf

DOI

10.1109/ICECS.2012.6463782

Filename

6463782