Title :
A system-proof-of-concept for remote measurement applications
Author :
Mailand, M. ; Getzlaff, S. ; DeHennis, A.
Author_Institution :
ZMDI, Zentrum Mikroelektron. Dresden AG, Dresden, Germany
Abstract :
This paper presents the chip level architecture and characterization results for a near field communication (NFC) ASIC that enables a new level of integration for remotely powered, wireless sensors. The multi-sensor input IC has the capability to measure temperature, voltage, current as well as light levels through two integrated photo-detectors. The variety of transducer inputs make it a suitable candidate for numerous sensing applications. This paper presents the bench level tests that have been run on packaged die that characterize its application performance for measuring glucose through its optical front end.
Keywords :
electric current measurement; photodetectors; sugar; system-on-chip; temperature measurement; voltage measurement; ASIC; application performance; bench level tests; chip level architecture; current measurement; glucose measurement; integrated photo-detectors; light levels; multisensor input IC; near field communication; optical front end; packaged die; remote measurement applications; remotely powered wireless sensors; sensing applications; temperature measurement; transducer inputs; voltage measurement; Current measurement; Light emitting diodes; Optical variables measurement; Temperature measurement; Temperature sensors; Voltage measurement;
Conference_Titel :
Electronics, Circuits and Systems (ICECS), 2012 19th IEEE International Conference on
Conference_Location :
Seville
Print_ISBN :
978-1-4673-1261-5
Electronic_ISBN :
978-1-4673-1259-2
DOI :
10.1109/ICECS.2012.6463782
