DocumentCode :
59707
Title :
LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs
Author :
Yu-Min Lee ; Chi-Wen Pan ; Pei-Yu Huang ; Chi-Ping Yang
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
34
Issue :
8
fYear :
2015
fDate :
Aug. 2015
Firstpage :
1250
Lastpage :
1263
Abstract :
To sustain Moore´s law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via.
Keywords :
circuit simulation; cooling; matrix algebra; table lookup; thermal analysis; three-dimensional integrated circuits; 3-D IC; ANSYS; I-LUTSim; LUTSim; Moore law; S-LUTSim; SuperLU; full-chip thermal analysis; heat dissipation; incremental-thermal updating; look-up table approach; matrix solver; on-chip thermal effect; power density; stacked die; thermal simulator; three-dimensional integrated circuit; through silicon via; Conductivity; Engines; Integrated circuit modeling; Table lookup; Thermal analysis; Thermal conductivity; 3-D IC; Look-up table; look-up table; thermal simulator; three-dimensional integrated circuit (3-D IC);
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2015.2401578
Filename :
7036103
Link To Document :
بازگشت