Title :
Design of temperature sensor array in smart electric grid based on SAW resonators
Author :
Yu-lin Han ; Zhen Li ; Zhen-wei Qi ; Yue Hu ; Bo-quan Liu ; Tao Han ; Ji Wang
Author_Institution :
Sch. of Electron. Inf. & Electr. Eng., Shanghai Jiaotong Univ., Shanghai, China
Abstract :
The sensor array with six sensors working at the frequency range of 429-436 MHz is designed and fabricated. The temperature sensitivity can be accurately controlled by the metallization thickness of the resonator on quartz substrate to keep the temperature-induced frequency shifts of each sensor within a limited bandwidth over a wide operating temperature ranging from -40°C to +150°C. The thermal parameters of sensor encapsulation are optimized according to the high voltage switchgear application. In order to meet the real-time requirement of sensor array measurement, discrete Hartley Transform (DHT) and the method of fast searching center frequency of sensors by comparison of I/Q and interrogation signals are used to reduce the query time, greatly improving the efficiency of polling of the sensor array. The measurement uncertainty of the practical SAW temperature sensor is less than 1°C, and the sensitivity of sensor is up to 4 KHz/°C.
Keywords :
encapsulation; metallisation; sensor arrays; smart power grids; surface acoustic wave resonators; switchgear; temperature sensors; DHT; SAW resonators; discrete Hartley transform; high voltage switchgear application; interrogation signal; polling efficiency; quartz substrate; query time; resonator metallization thickness; sensor array measurement; sensor encapsulation; smart electric grid; temperature sensitivity; temperature sensor array design; temperature-induced frequency shift; thermal parameters; Arrays; Frequency measurement; Resonant frequency; Surface acoustic waves; Temperature measurement; Temperature sensors; Wireless communication; SAW; Sensor array; Smart electric grid; Temperature;
Conference_Titel :
Piezoelectricity, Acoustic Waves and Device Applications (SPAWDA), 2012 Symposium on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-4814-0
DOI :
10.1109/SPAWDA.2012.6464115