DocumentCode :
597608
Title :
Bipolar resistive switching characteristics in Si3N4-based RRAM with MIS (Metal-Insulator-Silicon) structure
Author :
Sungjun Kim ; Sunghun Jung ; Jeong-Hoon Oh ; Kyung-Chang Ryoo ; Byung-Gook Park
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
fYear :
2013
fDate :
2-4 Jan. 2013
Firstpage :
303
Lastpage :
305
Abstract :
In this paper, bipolar resistive switching was investigated in our fabricated Ti/Si3N4/p+-Si resistive random access memory (RRAM) devices. Heavily doped p-type Si was used instead of a conventional bottom electrode (BE) using metal such as Pt. We found that forming-free process, self-compliance and gradual reset were shown in this device. The operation voltage was with 1.8~3.5 V during set process due to forming-free process. And self-compliance was observed by restriction of parasitic resistance without external current limiter. Finally, multi-level cell (MLC) feasibility was achieved using voltage stop during gradual reset.
Keywords :
MIS structures; random-access storage; silicon compounds; titanium; MIS structure; RRAM; Ti-Si3N4; bipolar resistive switching; bottom electrode; current limiter; forming-free process; gradual reset; multi-level cell; parasitic resistance; self-compliance; voltage 1.8 V to 3.5 V; Electrodes; Flash memory; Metals; Resistance; Silicon; Switches; MIS structure); Si3N4 based RRAM;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2013 IEEE 5th International
Conference_Location :
Singapore
ISSN :
2159-3523
Print_ISBN :
978-1-4673-4840-9
Electronic_ISBN :
2159-3523
Type :
conf
DOI :
10.1109/INEC.2013.6466030
Filename :
6466030
Link To Document :
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