Title :
On pairing bipolar RRAM memory element with novel punch-through diode based selector: Compact modeling to array performance
Author :
Mandapati, R. ; Borkar, A. ; Srinivasan, V.S.S. ; Karkare, P.B.P. ; Lodha, Saurabh ; Ganguly, Utsav
Author_Institution :
Dept. of Electr. Eng., IIT Bombay, Mumbai, India
Abstract :
To reduce sneak currents in high density non-volatile Bipolar RRAM technology the bipolar selector diode with high on-current density and larger on-off current ratio is required. Recently, we have experimentally demonstrated an n+/p/n+ stack based epitaxial Si punch-through diode for selector application with excellent TCAD matching. This selector technology provides flexibility in on-voltage (Von), on-current (Ion) and on-off current ratio. Here we present a performance evaluation of bipolar RRAM array using NPN selector. First we develop a compact circuit model of the novel punch-through diode. Second we develop a methodology of pairing a specific NPN selector with a bipolar RRAM memory based on cross-point requirements. SPICE implementation based array performance analysis shows an optimal cross-point on-off current ratio (e.g. 3×104 for 1M array) for minimum array power.
Keywords :
bipolar memory circuits; elemental semiconductors; integrated circuit modelling; random-access storage; silicon; NPN selector; RRAM array; SPICE implementation; TCAD matching; array performance analysis; bipolar RRAM memory element; bipolar selector diode; compact circuit model; epitaxial silicon punch-through diode; high-density nonvolatile bipolar RRAM technology; on-current density; optimal cross-point on-off current ratio; punch-through diode-based selector; sneak current reduction; Arrays; Electron devices; Integrated circuit modeling; Memory management; Performance evaluation; Power dissipation; Resistance; Bipolar RRAM; Cross-point memory array; Punch-through selector; Resistance ratio;
Conference_Titel :
Nanoelectronics Conference (INEC), 2013 IEEE 5th International
Conference_Location :
Singapore
Print_ISBN :
978-1-4673-4840-9
Electronic_ISBN :
2159-3523
DOI :
10.1109/INEC.2013.6466032