DocumentCode :
597654
Title :
The side effects on N-Type FinFET Devices
Author :
Hsin-Chia Yang ; Chong-Kuan Du ; Wen-Shiang Liao ; Jing-Zong Jhang ; Yi-Hong Lee ; Tsao-Yeh Chen ; Ko-Fan Liao ; Mu-Chun Wang ; SungChing Chi ; Shea-Jue Wang
Author_Institution :
Dept. of Electron. Eng., Minghsin Univ. of Sci. & Technol., Hsinchu, Taiwan
fYear :
2013
fDate :
2-4 Jan. 2013
Firstpage :
483
Lastpage :
485
Abstract :
Fin-FET is so expected because it protects Ioff current from outrageously leaky as the channel length gets shorten continuously. It thus keeps the threshold voltage and the swing from rolling-up. Those good characteristics are manifested by the fully depleted region and the lack of leaky body as the gate is biased. In this study, the fin-thickness effect is to be noticeably discussed. The correlated swings are to be determined and compared between the two kinds. The P-well Vt adjustment at two different energies, 10KeV and 6KeV, are also put into split.
Keywords :
MOSFET; N-type FinFET device; P-well Vt adjustment; correlated swings; electron volt energy 10 keV; electron volt energy 6 keV; fin-thickness effect; threshold voltage; FinFETs; Implants; Leakage current; Logic gates; Reliability; Silicon on insulator technology; Threshold voltage; 3-D Fin Structure; FinFET Devices; Leakage current; Over Etching); Over Exposure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2013 IEEE 5th International
Conference_Location :
Singapore
ISSN :
2159-3523
Print_ISBN :
978-1-4673-4840-9
Electronic_ISBN :
2159-3523
Type :
conf
DOI :
10.1109/INEC.2013.6466084
Filename :
6466084
Link To Document :
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