• DocumentCode
    597832
  • Title

    Impact of bulk/SOI 10nm FinFETs on 3T1D-DRAM cell performance

  • Author

    Amat, Esteve ; Almudever, C.G. ; Aymerich, N. ; Canal, Ramon ; Rubio, Albert

  • Author_Institution
    Dept. of Electron., Univ. Politec. de Catalunya, Barcelona, Spain
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    While the feasibility of SOI or bulk substrates for 10nm FinFETs has been shown, their impact on 3T1D memory performance has not been studied yet. In our study, bulk-based FinFETs show a better behavior for golden devices. Nevertheless, when variation is factored in, SOI-based FinFETs present better tolerance and, consequently, lower performance spread than bulk-based devices. When considering environment temperature it is always a detrimental factor for both multi-gate devices, but the impact is lower for the bulk ones.
  • Keywords
    DRAM chips; MOSFET; silicon-on-insulator; 3T1D memory performance; 3T1D-DRAM cell performance; SOI FinFET; bulk FinFET; golden device; multigate device; size 10 nm; Capacitance; FinFETs; Fluctuations; Logic gates; Performance evaluation; Random access memory; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6466713
  • Filename
    6466713