DocumentCode
59808
Title
Review of Silicon Power Semiconductor Technologies for Power Supply on Chip and Power Supply in Package Applications
Author
Disney, Don ; Shen, Z. John
Author_Institution
Avogy Inc., San Jose, CA, USA
Volume
28
Issue
9
fYear
2013
fDate
Sept. 2013
Firstpage
4168
Lastpage
4181
Abstract
This paper provides an overview of the fundamental operating principles of power semiconductor devices and reviews the state-of-the-art power device technologies which are most relevant to the realization of power supply on chip and power supply in package solutions. Power switching devices are divided into four categories low-voltage discrete transistors, high-voltage discrete transistors, low-voltage power ICs, and high-voltage power ICs. Advantages and disadvantages of different device technologies are compared and analyzed. Future technology trends are discussed.
Keywords
elemental semiconductors; power integrated circuits; power semiconductor devices; power supply circuits; silicon; system-in-package; system-on-chip; high-voltage discrete transistors; high-voltage power IC; low-voltage discrete transistors; low-voltage power IC; power semiconductor technologies; power supply in package; power supply on chip; Junctions; Logic gates; Power MOSFET; Silicon on insulator technology; Switches; Transistors; Power converters; power integrated circuits; power semiconductor devices; power transistors; system-in-a-package; system-on-a-chip;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2013.2242095
Filename
6463482
Link To Document