DocumentCode :
598287
Title :
Reliability of inversion channel InGaAs n-MOSFETs
Author :
Ming-Fu Li ; Guangfan Jiao ; Yi Xuan ; Daming Huang ; Ye, Peide D.
Author_Institution :
Dept. Microelectron., Fudan Univ., Shanghai, China
fYear :
2012
fDate :
Oct. 29 2012-Nov. 1 2012
Firstpage :
1
Lastpage :
4
Abstract :
Reliability of InGaAs inversion channel n-MOSFET is investigated by systematic PBTI (positive bias temperature instability) stresses. The very complicated degradation phenomena are totally different from Si based MOSFETs. The degradation is mainly contributed by the generation of border traps under stress with recoverable donor trap of energy density ΔDSOXDONOR in the InGaAs energy gap with a tail extending to the conduction band energy, and with permanent acceptor trap of energy density ΔDSOXACCEPTOR in the conduction band energy with a tail extending to the energy gap. The border trap model can explain all the experimental details of the PBTI degradation phenomena.
Keywords :
III-V semiconductors; MOSFET; electron traps; energy gap; gallium arsenide; indium compounds; semiconductor device reliability; InGaAs; PBTI degradation phenomena; border trap; conduction band energy; donor trap; energy density; energy gap; inversion channel n-MOSFET; permanent acceptor trap; positive bias temperature instability stress; reliability; systematic PBTI; Degradation; Dielectric measurements; Educational institutions; Indium gallium arsenide; Logic gates; MOSFET circuits; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
Type :
conf
DOI :
10.1109/ICSICT.2012.6467593
Filename :
6467593
Link To Document :
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