Title :
Resistive switching random access memory — Materials, device, interconnects, and scaling considerations
Author :
Yi Wu ; Jiale Liang ; Shimeng Yu ; Ximeng Guan ; Wong, H.-S Philip
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
Abstract :
In this paper, we review recent progresses on metal oxide resistive switching memory (RRAM). RRAM device design is explored from different aspects including oxide/electrode materials, uniformity issues, and scaling down to single-digit-nm regime. We studied the stochastic nature of resistive switching in metal oxide RRAM and revealed the physics behind switching parameter variations in HfOx-based RRAM using a 2D analytical solver. In a forward-looking analysis into the sub-10 nm regime, we investigated the impact of wordline/bitline metal wire scaling on the read/write performance, energy consumption in the cross-point memory array architecture.
Keywords :
electrodes; integrated circuit design; integrated circuit interconnections; memory architecture; random-access storage; switching circuits; 2D analytical solver; HfO; RRAM device design; cross-point memory array architecture; energy consumption; forward-looking analysis; metal oxide RRAM; metal oxide resistive switching memory; oxide-electrode materials; resistive switching random access memory; switching parameter variations; wordline-bitline metal wire scaling; Arrays; Electrodes; Materials; Metals; Resistance; Switches; Wires;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location :
South Lake Tahoe, CA
Print_ISBN :
978-1-4673-2749-7
DOI :
10.1109/IIRW.2012.6468906