• DocumentCode
    598746
  • Title

    A method for low-K dielectric breakdown physical localization

  • Author

    Chery, E. ; Federspiel, Xavier ; Beylier, G. ; Volpi, F. ; Chaix, J.

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2012
  • fDate
    14-18 Oct. 2012
  • Firstpage
    119
  • Lastpage
    121
  • Abstract
    This paper reports results obtained on a new test structure developed to easily locate low-k dielectric breakdown spots. This spot can be localized by using a comb-serpentine test structure, and by monitoring the change in resistance between pads.
  • Keywords
    electric breakdown; low-k dielectric thin films; comb-serpentine test structure; low-k dielectric breakdown physical localization method; low-k dielectric breakdown spot location; Dielectrics; Electric breakdown; Metals; Reliability; Resistance; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4673-2749-7
  • Type

    conf

  • DOI
    10.1109/IIRW.2012.6468934
  • Filename
    6468934
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=598746