DocumentCode
598762
Title
Design considerations for radio frequency 3DICs
Author
Ying-Cheng Tseng ; Chang-Bao Chang ; Chin-Khai Tang ; Chi-Hsuan Cheng ; Yi-Chang Lu ; Kun-You Lin ; Tzong-Lin Wu ; Ruey-Beei Wu
Author_Institution
Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2012
fDate
9-11 Dec. 2012
Firstpage
197
Lastpage
200
Abstract
In this paper, we first compare different configurations of RF 3DICs. Through simulations, we research how different TSV geometries affect the dissipation loss, coupling effect, and group delay of RF signals. We also study electromigration issues of power TSVs. Finally, we demonstrate a TSV spiral inductor with a Q factor of 14.9.
Keywords
radiofrequency integrated circuits; three-dimensional integrated circuits; Q factor; RF 3DIC; RF signal; TSV geometry; TSV spiral inductor; coupling effect; dissipation loss; electromigration; group delay; power TSV; radio frequency 3DIC; Couplings; Inductors; Radio frequency; Silicon; Spirals; Substrates; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location
Taipei
Print_ISBN
978-1-4673-1444-2
Electronic_ISBN
978-1-4673-1445-9
Type
conf
DOI
10.1109/EDAPS.2012.6469423
Filename
6469423
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