Title :
Design considerations for radio frequency 3DICs
Author :
Ying-Cheng Tseng ; Chang-Bao Chang ; Chin-Khai Tang ; Chi-Hsuan Cheng ; Yi-Chang Lu ; Kun-You Lin ; Tzong-Lin Wu ; Ruey-Beei Wu
Author_Institution :
Grad. Inst. of Commun. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
In this paper, we first compare different configurations of RF 3DICs. Through simulations, we research how different TSV geometries affect the dissipation loss, coupling effect, and group delay of RF signals. We also study electromigration issues of power TSVs. Finally, we demonstrate a TSV spiral inductor with a Q factor of 14.9.
Keywords :
radiofrequency integrated circuits; three-dimensional integrated circuits; Q factor; RF 3DIC; RF signal; TSV geometry; TSV spiral inductor; coupling effect; dissipation loss; electromigration; group delay; power TSV; radio frequency 3DIC; Couplings; Inductors; Radio frequency; Silicon; Spirals; Substrates; Through-silicon vias;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469423
