Title :
Electromagnetic emissions from the IC packaging
Author :
Huang, N.K.H. ; Li Jun Jiang ; Huichun Yu ; Gang Li ; Shuai Xu ; Tao Wang ; Huasheng Ren
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
Abstract :
The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results.
Keywords :
electromagnetic compatibility; electromagnetic interference; integrated circuit packaging; EMC; EMI; IC packaging; PI; SI; electromagnetic emissions; electromagnetic radiations; power integrity; radiation mechanisms; signal integrity; traces; vias; Cavity resonators; Electromagnetic compatibility; Electromagnetic interference; Heating; Integrated circuit packaging; Microstrip; Packaging; EMC/EMI; IC packaging; cavity modes; radiated emission; trace radiation; via radiation;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469426
