Electromagnetic emissions from the IC packaging

Author

Huang, N.K.H. ; Li Jun Jiang ; Huichun Yu ; Gang Li ; Shuai Xu ; Tao Wang ; Huasheng Ren

Author_Institution

Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China

fYear

2012

fDate

9-11 Dec. 2012

Firstpage

65

Lastpage

68

Abstract

The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results.

Keywords

electromagnetic compatibility; electromagnetic interference; integrated circuit packaging; EMC; EMI; IC packaging; PI; SI; electromagnetic emissions; electromagnetic radiations; power integrity; radiation mechanisms; signal integrity; traces; vias; Cavity resonators; Electromagnetic compatibility; Electromagnetic interference; Heating; Integrated circuit packaging; Microstrip; Packaging; EMC/EMI; IC packaging; cavity modes; radiated emission; trace radiation; via radiation;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE

Conference_Location

Taipei

Print_ISBN

978-1-4673-1444-2

Electronic_ISBN

978-1-4673-1445-9

Type

conf

DOI

10.1109/EDAPS.2012.6469426

Filename

6469426