Title :
Mobile Commerce Trust Model and its Application for Third Party Trust Service Platform
Author :
Chunhui Piao ; Shuzhen Wang ; Jie Wen ; Yongchun Luo
Author_Institution :
Sch. of Econ. & Manage., Shijiazhuang Tiedao Univ., Shijiazhuang, China
Abstract :
A theory framework of influence factors of consumers´ trust in mobile commerce is established. Then a questionnaire on trust evaluation of mobile commerce is designed, and reliability analysis and validity analysis on the trust evaluation scale are conducted respectively. Based on SEM, first-order confirmatory factor analysis is used to test the established trust evaluation model for mobile commerce, and second-order factor analysis is applied to determine the weights of trust influence factors. An indicator system for evaluating the trustworthiness of mobile vendors is proposed. The openness for the transaction-related data of four main mobile commerce platforms is analyzed. An ELECTREIII-based algorithm for evaluating the trustworthiness of mobile-vendors is designed. Empirical analysis shows that the proposed trust model and trustworthiness evaluation algorithm can be rationally and meaningfully used to make mobile vendors recommendation by third party trust service provider.
Keywords :
mobile commerce; security of data; statistical analysis; ELECTREIII-based algorithm; SEM; consumer trust influence factors; empirical analysis; first-order confirmatory factor analysis; indicator system; mobile commerce trust model; mobile vendor trustworthiness; reliability analysis; second-order factor analysis; structural equation modeling; third party trust service platform; third party trust service provider; trust evaluation scale; validity analysis; Analytical models; Business; Mathematical model; Mobile communication; Mobile computing; Reliability; Wireless application protocol; m-commerce; second-order factor analysis; structural equation modeling (SEM); trust evaluation; trustworthiness; vendor recommendation;
Conference_Titel :
Commerce and Enterprise Computing (CEC), 2012 IEEE 14th International Conference on
Conference_Location :
Hangzhou
Print_ISBN :
978-1-4673-6246-7
DOI :
10.1109/CEC.2012.27