Title :
SPICE Model of a Single Twisted-Wire Pair Illuminated by a Plane Wave in Free Space
Author :
Keliang Yuan ; Jianguo Wang ; Haiyan Xie ; Ruyu Fan
Author_Institution :
Dept. of Eng. Phys., Tsinghua Univ., Beijing, China
Abstract :
A SPICE model for the twisted-wire pair with uniform twists in free space is proposed in this paper, which is capable of calculating the transient terminal response of the twisted-wire pair terminated with nonlinear loads in the presence of a transient plane wave illumination. The model differs from its counterpart for a straight-wire pair in that an extra convolution is included in the source terms, which can be calculated efficiently by the recursive convolution method. For the sake of convenience, the derivation of the model is made in the frequency domain on the basis of the transmission-line theory. The resultant expressions are compared with the outcome of the method of moments, showing that the transmission-line model can be applied to the twisted-wire pair with loose twists. Furthermore, the low-frequency coupling properties and resonant peak of the twisted-wire pairs are investigated according to the derived approximate formulae. Based on the frequency-domain results, a SPICE model for the twisted-wire pair is proposed in the time domain before it is verified and applied to the twisted-wire pair terminated with nonlinear loads.
Keywords :
SPICE; convolution; electromagnetic pulse; frequency-domain analysis; transmission line theory; SPICE model; frequency domain analysis; method of moments; plane wave; recursive convolution method; single twisted-wire pair; transient electromagnetic pulses; transient plane wave illumination; transient terminal response; transmission-line model; uniform twists; Convolution; Integrated circuit modeling; Load modeling; Mathematical model; Power transmission lines; SPICE; Wires; Nonlinear load; SPICE model; radiated susceptibility; recursive convolution; transmission line (TL); twisted-wire pair (TWP);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2015.2392852