• DocumentCode
    600624
  • Title

    Low temperature wafer bonding of silicon to InP and silicon to LiNbO3 using self-assembled monolayers

  • Author

    Artel, V. ; Bakish, Idan ; Kraus, Thomas ; Shubely, M. ; Ben-Ezra, Y. ; Shekel, E. ; Zach, S. ; Zadok, Avi ; Sukenik, C.N.

  • Author_Institution
    Dept. of Chem. & Inst. for nano-Technol. & Adv. Mater., Bar-Ilan Univ., Ramat-Gan, Israel
  • fYear
    2012
  • fDate
    4-8 March 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.
  • Keywords
    III-V semiconductors; elemental semiconductors; indium compounds; integrated optoelectronics; lithium compounds; niobium compounds; silicon; wafer bonding; InP; LiNbO3; Si; low temperature wafer bonding; self-assembled monolayers; Bonding; Chemistry; Indium phosphide; Lithium niobate; Silicon; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference
  • Conference_Location
    Los Angeles, CA
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-0262-3
  • Type

    conf

  • Filename
    6476449
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=600624