Title :
Low temperature wafer bonding of silicon to InP and silicon to LiNbO3 using self-assembled monolayers
Author :
Artel, V. ; Bakish, Idan ; Kraus, Thomas ; Shubely, M. ; Ben-Ezra, Y. ; Shekel, E. ; Zach, S. ; Zadok, Avi ; Sukenik, C.N.
Author_Institution :
Dept. of Chem. & Inst. for nano-Technol. & Adv. Mater., Bar-Ilan Univ., Ramat-Gan, Israel
Abstract :
Procedures for wafer bonding between silicon and InP and between silicon and LiNbO3 at temperatures below 120 °C are reported. The bonding is based on the deposition of functionalized, organic self assembled monolayers.
Keywords :
III-V semiconductors; elemental semiconductors; indium compounds; integrated optoelectronics; lithium compounds; niobium compounds; silicon; wafer bonding; InP; LiNbO3; Si; low temperature wafer bonding; self-assembled monolayers; Bonding; Chemistry; Indium phosphide; Lithium niobate; Silicon; Surface treatment;
Conference_Titel :
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference
Conference_Location :
Los Angeles, CA
Print_ISBN :
978-1-4673-0262-3
