DocumentCode :
60099
Title :
A Linear Complexity Direct Volume Integral Equation Solver for Full-Wave 3-D Circuit Extraction in Inhomogeneous Materials
Author :
Omar, Saad ; Dan Jiao
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
63
Issue :
3
fYear :
2015
fDate :
Mar-15
Firstpage :
897
Lastpage :
912
Abstract :
An H2-matrix based linear complexity direct matrix solution is developed for the volume integral equation (VIE) based broadband full-wave extraction of general 3-D circuits. Such circuits are in general electrically small or moderate, but contain arbitrarily shaped lossy conductors immersed in inhomogeneous dielectrics with ports located anywhere in the physical layout of the circuit. In the proposed direct solver, we first develop a well-conditioned VIE formulation without sacrificing the rigor and the advantages of the prevailing formulations. This formulation facilitates a robust direct solution of good accuracy even with a rank-1 representation. We then overcome the numerical challenge of solving the resultant highly unstructured system matrix mixed with both square and rectangular dense and sparse matrices by developing a fast linear complexity direct solution. This direct solution is capable of inverting dense matrices involving over 2 million unknowns in less than 1 h on a single CPU core running at 3 GHz. Numerical simulations of large-scale 3-D circuits and comparisons with state-of-the-art linear complexity iterative VIE solvers have demonstrated the accuracy, efficiency, and linear complexity of the proposed direct VIE solver.
Keywords :
circuit complexity; dielectric materials; inhomogeneous media; integral equations; matrix inversion; sparse matrices; H2-matrix based linear complexity direct matrix solution; VIE based broadband full-wave extraction; dense matrix inversion; frequency 3 GHz; full-wave 3D circuit extraction; general 3D circuits; inhomogeneous dielectric materials; linear complexity direct volume integral equation solver; linear complexity iterative VIE solvers; numerical simulations; physical layout; rank-1 representation; shaped lossy conductors; single CPU core; sparse matrices; unstructured system matrix; Accuracy; Complexity theory; Conductors; Integrated circuit modeling; Nonhomogeneous media; Sparse matrices; 3-D structures; Circuit modeling; S-parameter extraction; fast solvers; full-wave analysis; impedance extraction; linear complexity solvers; volume integral equations (VIEs);
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/TMTT.2015.2396494
Filename :
7036143
Link To Document :
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