DocumentCode
601587
Title
Double-sided cooling design for novel planar module
Author
Ning, Puqi ; Liang, Zhenxian ; Wang, Fei
Author_Institution
Energy and Environmental Sciences Directorate, Oak Ridge National Lab, Knoxville, TN, USA
fYear
2013
fDate
17-21 March 2013
Firstpage
616
Lastpage
621
Abstract
A novel packaging structure for medium power modules featuring power semiconductor switches sandwiched between two symmetric substrates that fulfill electrical conduction and insulation functions is presented. Large bonding areas between dies and substrates allow this packaging technology to offer significant improvements in electrical, thermal performance. Double-sided cooling system was dedicatedly analyzed and designed for different applications.
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
Conference_Location
Long Beach, CA, USA
ISSN
1048-2334
Print_ISBN
978-1-4673-4354-1
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2013.6520274
Filename
6520274
Link To Document