DocumentCode
601976
Title
Thermoelectric Cooling for power electronics circuits: Modeling and applications
Author
Cong Li ; Da Jiao ; Mohan, H. ; Feng Guo ; Jin Wang
Author_Institution
Electr. & Comput. Eng. Dept., Ohio State Univ., Columbus, OH, USA
fYear
2013
fDate
17-21 March 2013
Firstpage
3275
Lastpage
3282
Abstract
This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.
Keywords
power electronics; reliability; semiconductor switches; temperature control; thermoelectric cooling; dynamic base temperature control; optimal operation range; power electronics circuits; power electronics switches; switch lifetime; system reliability; thermoelectric cooling; thermoelectric model;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
Conference_Location
Long Beach, CA
ISSN
1048-2334
Print_ISBN
978-1-4673-4354-1
Electronic_ISBN
1048-2334
Type
conf
DOI
10.1109/APEC.2013.6520770
Filename
6520770
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