• DocumentCode
    601976
  • Title

    Thermoelectric Cooling for power electronics circuits: Modeling and applications

  • Author

    Cong Li ; Da Jiao ; Mohan, H. ; Feng Guo ; Jin Wang

  • Author_Institution
    Electr. & Comput. Eng. Dept., Ohio State Univ., Columbus, OH, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    3275
  • Lastpage
    3282
  • Abstract
    This paper discusses the modeling and application of Thermoelectric Cooling (TEC) in power electronics circuits. To investigate the benefits and challenges of using TEC, a comprehensive thermoelectric model which includes both power electronics circuit and TEC device is presented. With this model, the optimal operation range and dynamic base temperature control of power electronics switches are analyzed. The results show that with TEC, the base temperature of power electronics switches can maintain almost constant under different load conditions. Therefore, the switch lifetime and overall system reliability will be improved. Both simulation and experimental results are presented in this paper to verify the analysis.
  • Keywords
    power electronics; reliability; semiconductor switches; temperature control; thermoelectric cooling; dynamic base temperature control; optimal operation range; power electronics circuits; power electronics switches; switch lifetime; system reliability; thermoelectric cooling; thermoelectric model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2013 Twenty-Eighth Annual IEEE
  • Conference_Location
    Long Beach, CA
  • ISSN
    1048-2334
  • Print_ISBN
    978-1-4673-4354-1
  • Electronic_ISBN
    1048-2334
  • Type

    conf

  • DOI
    10.1109/APEC.2013.6520770
  • Filename
    6520770