Title :
Cavity packages for volume MEMS applications
Author_Institution :
Tech. Program Manage., Unisem Eur. Ltd., UK
Abstract :
This article consists of a collection of slides from the author´s conference presentation. Some of the specific areas/topics discussed include: MEMS market; cavity package; LGA-FL; formed lid cavity packages; LGA-MC; molded cavity packages; LGA-ML; molded lid cavity packages; MEMS materials; process flow; cavity package modeling and cavity package reliability.
Keywords :
electronics packaging; micromechanical devices; moulding; reliability; LGA-FL; LGA-MC; LGA-ML; MEMS market; MEMS material; cavity package modeling; cavity package reliability; formed lid cavity packaging; molded cavity packaging; molded lid cavity packaging; process flow;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2012.6521801
