• DocumentCode
    602362
  • Title

    Cavity packages for volume MEMS applications

  • Author

    Evans, Adrian

  • Author_Institution
    Tech. Program Manage., Unisem Eur. Ltd., UK
  • fYear
    2012
  • fDate
    6-8 Nov. 2012
  • Firstpage
    1
  • Lastpage
    24
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation. Some of the specific areas/topics discussed include: MEMS market; cavity package; LGA-FL; formed lid cavity packages; LGA-MC; molded cavity packages; LGA-ML; molded lid cavity packages; MEMS materials; process flow; cavity package modeling and cavity package reliability.
  • Keywords
    electronics packaging; micromechanical devices; moulding; reliability; LGA-FL; LGA-MC; LGA-ML; MEMS market; MEMS material; cavity package modeling; cavity package reliability; formed lid cavity packaging; molded cavity packaging; molded lid cavity packaging; process flow;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
  • Conference_Location
    Ipoh
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4673-4384-8
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2012.6521801
  • Filename
    6521801
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=602362