DocumentCode :
602375
Title :
Highlights of iNEMI 2013 technology roadmaps
Author :
Pfahl, Bob ; Fu, Haley ; Richardson, Chuck
Author_Institution :
International Electronics Manufacturing Initiative, USA
fYear :
2012
fDate :
6-8 Nov. 2012
Firstpage :
1
Lastpage :
5
Abstract :
iNEMI (International Electronics Manufacturing Initiative) has been creating and exploiting technology roadmaps for the electronics industry for 20 years. It has become recognized as an important tool for defining the “state of the art” in the electronics industry as well as identifying emerging and disruptive technologies. It also includes keys to developing future iNEMI projects and setting industry R&D priorities over the next 10 years. The roadmap is updated every two years with global participation from the industry. The 2013 version of iNEMI roadmap will be released to the public in March 2013. This paper provides a preview of the electronics industry paradigm shifts and the key technology developments and issues. It focuses on the Organic Packaging and Organic PCB Roadmaps, and on the Gap Analysis Process and Resulting iNEMI Actions
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2012 35th IEEE/CPMT International
Conference_Location :
Ipoh, Perak, Malaysia
ISSN :
1089-8190
Print_ISBN :
978-1-4673-4384-8
Electronic_ISBN :
1089-8190
Type :
conf
DOI :
10.1109/IEMT.2012.6521822
Filename :
6521822
Link To Document :
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