Title :
Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM
Author :
Mu-Tien Chang ; Rosenfeld, P. ; Shih-Lien Lu ; Jacob, Biji
Abstract :
Large last-level caches (L3Cs) are frequently used to bridge the performance and power gap between processor and memory. Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L3Cs. Each of these technologies has inherent weaknesses: SRAM is relatively low density and has high leakage current; STT-RAM has high write latency and write energy consumption; and eDRAM requires refresh operations. As future processors are expected to have larger last-level caches, the goal of this paper is to study the trade-offs associated with using each of these technologies to implement L3Cs. In order to make useful comparisons between SRAM, STTRAM, and eDRAM L3Cs, we model them in detail and apply low power techniques to each of these technologies to address their respective weaknesses. We optimize SRAM for low leakage and optimize STT-RAM for low write energy. Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. A comparison of these technologies through full-system simulation shows that the proposed refresh-reduction method makes eDRAM a viable, energy-efficient technology for implementing L3Cs.
Keywords :
DRAM chips; MRAM devices; SRAM chips; cache storage; energy consumption; low-power electronics; power aware computing; L3C; MRAM; dead-line prediction; eDRAM refresh-reduction schemes; energy-efficient technology; full-system simulation; large last-level caches; leakage current; low power techniques; low write-energy STT-RAM; low-leakage SRAM; refresh operations; refresh-optimized eDRAM; refresh-reduction method; technology comparison; write energy consumption; write latency; CMOS integrated circuits; CMOS technology; Capacitors; Magnetic tunneling; Radiation detectors; Random access memory; Transistors;
Conference_Titel :
High Performance Computer Architecture (HPCA2013), 2013 IEEE 19th International Symposium on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4673-5585-8
DOI :
10.1109/HPCA.2013.6522314