Title :
The 3.0GHz 64-thread SPARC T4 processor
Author :
Shin, Jinuk Luke ; Golla, Robert ; Hongping Li ; Dash, Shishir ; Doherty, Mary Jo ; Grohoski, Greg ; McAllister, Curtis
Author_Institution :
Oracle, Santa Clara, CA, USA
Abstract :
The SPARC T4 processor introduces the next generation multi-threaded S3 core and delivers a significant single-thread performance improvement over its predecessor. The chip integrates eight S3 cores, an 8-Bank 4MB L3 Cache, a 768GB/sec crossbar, a memory controller, PCI Gen2.0, 10G Ethernet and a cache coherency controller with 2.4Tb/s highspeed I/Os. The dual-issue, out-of-order execution core features a 16-stage integer pipeline, extensive branch predictions, dynamic threading and an enhanced cryptographic processing unit. The 406mm2 die is fabricated in TSMC´s 40nm process and contains 855million transistors and 2.6million flip-flops in a flipchip ceramic package. Enhanced physical design methodologies and extensive power management features enable 3.0GHz operation in the same power envelope of its predecessor.
Keywords :
cache storage; cryptography; flip-chip devices; flip-flops; local area networks; microwave devices; multi-threading; multiprocessing systems; parallel memories; peripheral interfaces; pipeline processing; 16-stage integer pipeline; 64-thread SPARC T4 processor; 8-bank L3 cache; Ethernet; PCI Gen2.0; TSMC process; bit rate 2.4 Tbit/s; bit rate 768 Gbit/s; cache coherency controller; chip integration; cryptographic processing unit; dual-issue out-of-order execution core; dynamic threading; extensive branch predictions; flip-chip ceramic package; flip-flops; frequency 3 GHz; high-speed I-O; memory controller; next generation multithreaded S3 core; physical design methodologies; power management features; single-thread performance improvement; size 40 nm; storage capacity 4 Mbit;
Conference_Titel :
Solid State Circuits Conference (A-SSCC), 2012 IEEE Asian
Conference_Location :
Kobe
DOI :
10.1109/IPEC.2012.6522613