Title :
Wireless wafer probing for on-chip analog voltage measurement
Author :
Dae Young Lee ; Wentzloff, David D. ; Hayes, John P.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper demonstrates a method for wirelessly measuring analog voltage on DUTs. This technique can be used for test structure characterization. The proposed voltage-to-time converter enables analog voltage values to be wirelessly delivered through capacitive coupling. A dualslope architecture is adopted to mitigate the effects of onchip R and C variation, and an UWB pulse generator is used to relay accurate timing to the ATE with low-power consumption. A prototype, fabricated in 0.13 μm CMOS achieves 8-bit resolution with 1 mV measurement steps. The total area of the on-chip wireless voltage measurement circuit is 0.013 mm2 excluding wireless pads.
Keywords :
CMOS analogue integrated circuits; automatic test equipment; low-power electronics; pulse generators; radiofrequency measurement; ultra wideband technology; voltage measurement; ATE; CMOS; DUT; UWB pulse generator; capacitive coupling; dual-slope architecture; low-power consumption; on-chip C variation; on-chip R variation; on-chip wireless analog voltage measurement; size 0.13 mum; test structure characterization; voltage 1 mV; voltage-to-time converter; wireless wafer probing; word length 8 bit;
Conference_Titel :
Solid State Circuits Conference (A-SSCC), 2012 IEEE Asian
Conference_Location :
Kobe
DOI :
10.1109/IPEC.2012.6522691