Title :
Electrical properties of flexible Vertically aligned Carbon Nanotube bumps under compression
Author :
Fujino, Masahisa ; Terasaka, Haruo ; Suga, Takashi ; Soga, I. ; Kondo, Daishi ; Ishizuki, Yoshikatsu ; Iwai, Toshiki
Author_Institution :
Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan
Abstract :
In this research, bump-shaped Vertically Aligned Multi-walled Carbon Nanotubes (VA-CNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VA-CNT bumps under compression pressure were studied. The resistance of the bonded VA-CNT bumps with load was decreased under compression pressure. In this model, it is considered that the VA-CNTs were deformed permanently by the friction among the VA-CNTs. In order to solve the cause of the permanent deformation of the VA-CNT bumps, the friction among the CNTs during the compression is calculated.
Keywords :
carbon nanotubes; electric properties; flip-chip devices; integrated circuit interconnections; Au; bonded VA-CNT bumps; bump-shaped vertically aligned multiwalled carbon nanotubes; compression pressure; flexible vertically aligned carbon nanotube bump electrical properties; flip-chip interconnect;
Conference_Titel :
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-2654-4
DOI :
10.1109/ICSJ.2012.6523404
