Development of a novel thermal compression flip chip bonding with pre-applied NCF underfill

Author

Takeda, Kenji ; Koshi, T. ; Arai, Kenta ; Machida, Yoshinobu ; Oi, Kumiko ; Tamadate, Y. ; Sohara, T. ; Araki, Yuichi ; Ozawa, Toshihiro

Author_Institution

IC Assembly Div., Shinko Electr. Ind. Co., Ltd., Myoko, Japan

fYear

2012

fDate

10-12 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

In order to overcome problems associated with thermal compression flip chip bonding with post-applied liquid underfill, we have developed a novel process with pre-applied Non Conductive Film (NCF) underfill. This paper describes failure modes in post-applied liquid underfill and the development of the novel NCF process which has several advantages for IC-package assembly. Along with Au bump, this process is applicable to Sn/Ag capped Cu-pillar with ideal electrical connections and high reliability performance.

Keywords

assembling; failure analysis; flip-chip devices; gold; integrated circuit packaging; integrated circuit reliability; IC-package assembly; Sn-Ag-Cu; electrical connections; failure modes; gold bump; high-reliability performance; post-applied liquid underfill; pre-applied NCF underfill; pre-applied nonconductive film underfill; thermal compression flip chip bonding; tin-silver capped copper-pillar;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2012 2nd IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4673-2654-4

Type

conf

DOI

10.1109/ICSJ.2012.6523448

Filename

6523448