DocumentCode
602801
Title
Silicon and the wide bandgap semiconductors, shaping the future power electronic device market
Author
Gammon, Peter
Author_Institution
Sch. of Eng., Univ. of Warwick, Coventry, UK
fYear
2013
fDate
19-21 March 2013
Firstpage
9
Lastpage
13
Abstract
In this paper, the current state of the power electronic device market is reviewed in light of the increased challenge upon Si from the wide bandgap semiconductors SiC and GaN. It is suggested that for the next ten years Si will continue its dominance both at the low voltage, and at the high voltage, high current ends of the market. However, SiC in particular is most likely to make a robust challenge upon the 500-6.5 kV market, in application areas such as automotive and photovoltaic converters and in PFC power supplies. As materials issues such as defect densities and epitaxial layer thicknesses improve then the emergence of bipolar SiC devices could in 10-20 years see it challenge in the high voltage, high current end of the market also.
Keywords
III-V semiconductors; elemental semiconductors; gallium compounds; power convertors; power factor correction; power semiconductor devices; power supplies to apparatus; semiconductor epitaxial layers; silicon; silicon compounds; wide band gap semiconductors; GaN; PFC power supply; Si; SiC; automotive; bipolar device; defect density; epitaxial layer thickness; future power electronic device market; photovoltaic converter; time 10 year to 20 year; voltage 500 kV to 6.5 kV; wide bandgap semiconductor; Educational institutions; Gallium nitride; Insulated gate bipolar transistors; Lead; Logic gates; Silicon; Silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultimate Integration on Silicon (ULIS), 2013 14th International Conference on
Conference_Location
Coventry
Print_ISBN
978-1-4673-4800-3
Electronic_ISBN
978-1-4673-4801-0
Type
conf
DOI
10.1109/ULIS.2013.6523479
Filename
6523479
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