DocumentCode :
602810
Title :
Integration aspects of strained Ge pFETs
Author :
Witters, L. ; Eneman, Geert ; Mitard, J. ; Vincent, B. ; Loo, Roger ; Hikavyy, Andriy ; Milenin, A.P. ; Mertens, Sofie ; Thean, A. ; Collaert, Nadine
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2013
fDate :
19-21 March 2013
Firstpage :
49
Lastpage :
52
Abstract :
Strained Ge channel PFETs have the potential to outperform state-of-the-art strained Si channel PFETs. This paper describes the integration aspects for strained Ge channel devices based on TCAD simulations and experimental observations. Channel stress can be implemented by use of Si1-xGex strain relaxed buffers (SRB) and/or high Ge- and Sn-content source/drain stressors. Thermal budget, damage and Ge loss have to be limited during process integration to maintain the high stress in the Ge channel till the end of the processing.
Keywords :
Ge-Si alloys; elemental semiconductors; field effect transistors; germanium; technology CAD (electronics); tin; Ge; PFET; SRB; Si1-xGex; Sn; TCAD simulations; channel stress; drain stressors; integration aspects; source stressors; strain relaxed buffers; strained channel devices; Logic gates; Silicon; Silicon germanium; Transistors; Germanium; strain; strain relaxed buffer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultimate Integration on Silicon (ULIS), 2013 14th International Conference on
Conference_Location :
Coventry
Print_ISBN :
978-1-4673-4800-3
Electronic_ISBN :
978-1-4673-4801-0
Type :
conf
DOI :
10.1109/ULIS.2013.6523488
Filename :
6523488
Link To Document :
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