DocumentCode
602883
Title
Aging-aware timing analysis considering combined effects of NBTI and PBTI
Author
Kiamehr, Saman ; Firouzi, Farshad ; Tahoori, Mehdi B.
Author_Institution
Dept. of Comput. Sci. & Eng., Karlsruhe Inst. of Technol., Karlsruhe, Germany
fYear
2013
fDate
4-6 March 2013
Firstpage
53
Lastpage
59
Abstract
Transistor aging due to Bias Temperature Instability (BTI) and Hot Carrier Injection (HCI) is one of the major reliability issues of VLSI circuits fabricated at nanometer technology nodes. Transistor aging increases the circuit delay over the time and ultimately leads to lifetime reduction of VLSI chips. Accurate aging-aware timing analysis is a key requirement to consider these effects in the design cycle. Our analysis shows that a separate (independent) analysis of different sources of aging leads to significant overestimation of post-aging delay. To overcome the problem of existing methods, we propose a new aging-aware gate delay model that precisely captures the combined effect of different aging sources on delay. Our results obtained from a set of benchmark circuits show that, our proposed gate-delay model estimates the aging-induced Δdelay by 7.8% (translating to 36.0% MTTF) more accurately in comparison to prior techniques. Moreover, we present a flow for integrating the proposed gate delay model with commercial timing analysis tools.
Keywords
VLSI; ageing; delays; hot carriers; integrated circuit modelling; integrated circuit reliability; negative bias temperature instability; HCI; NBTI; PBTI; VLSI circuits; aging-aware gate delay model; aging-aware timing analysis; benchmark circuits; hot carrier injection; lifetime reduction; nanometer technology nodes; negative bias temperature instability; positive bias temperature instability; post-aging delay; transistor aging; Delays; Integrated circuit modeling; Integrated circuit reliability; Logic gates; Stress; Transistors; Very large scale integration; Aging; HCI; NBTI; PBTI; Timing Analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-4951-2
Type
conf
DOI
10.1109/ISQED.2013.6523590
Filename
6523590
Link To Document