• DocumentCode
    602897
  • Title

    A novel and efficient method for power pad placement optimization

  • Author

    Ting Yu ; Wong, Martin D. F.

  • Author_Institution
    Dept. of ECE, Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    158
  • Lastpage
    163
  • Abstract
    In this paper, we propose a novel and efficient iterative method for pad placement optimization of power grid with flip chip technology. Power grid with optimized pad placement has less IR-drop values. We develop a new method to calculate new locations of all pads. Placing pads at the new locations reduces local IR-drop values. In order to reduce global IR-drop values, we develop a graph-based strategy to decide which pads are moved to the new locations. After each movement of the pads, a static IR-drop analysis is performed. We develop multigrid accelerated modified Simulated Annealing method (MG_SA) and compare it with the proposed method on a set of test cases. Experimental results show that the proposed method outperforms MG_SA with similar or less IR-drop values and much less runtime.
  • Keywords
    flip-chip devices; graph theory; iterative methods; power grids; simulated annealing; MG_SA; flip chip technology; graph-based strategy; iterative method; multigrid accelerated modified simulated annealing method; power grid; power pad placement optimization; static IR-drop analysis; Runtime; IR-drop; pad placement; power grid;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523604
  • Filename
    6523604