• DocumentCode
    602915
  • Title

    Analysis and reliability test to improve the data retention performance of EPROM circuits

  • Author

    Jiyuan Luan ; DiVita, M.

  • Author_Institution
    Texas Instrum., Santa Clara, CA, USA
  • fYear
    2013
  • fDate
    4-6 March 2013
  • Firstpage
    273
  • Lastpage
    277
  • Abstract
    Data retention lifetime is an important specification for the long term durability of EPROM circuits. While most of the published EPROM data retention results are based on empirical data, this paper presents an analytical approach which can be used to quantify EPROM data retention lifetime based on the circuit implementation. Two types of EPROM circuits are analyzed- a single transistor EPROM cell as well as a differential EPROM circuit. Using this new approach, the EPROM data retention performance is converted to a minimal residual gate charge requirement of the EPROM device which can then be used to directly compare and analyze the data retention performance of the EPROM circuits. The results of the analysis and comparison suggest that circuit implementation has great impact on EPROM data retention lifetime, and they also provide valuable insights on ways to improve the reliability of EPROM circuits. The analysis result of this paper on the differential EPROM circuit is further validated by wafer level reliability test (WLR) completed on an actual IC implementation, which suggests a good agreement between theoretical analysis and actual WLR data.
  • Keywords
    EPROM; integrated circuit reliability; integrated circuit testing; EPROM data retention lifetime; EPROM data retention performance; WLR; differential EPROM circuit; long term durability specification; wafer level reliability test; EPROM; Integrated circuit reliability; MOSFET; Performance evaluation; Reliability theory; EPROM; Non volatile memory; data retention lifetime;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2013 14th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-4673-4951-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2013.6523622
  • Filename
    6523622