DocumentCode
602962
Title
Analysis, modeling and silicon correlation of low-voltage flop data retention in 28nm process technology
Author
Datta, Amitava ; Abu-Rahma, M. ; Dasnurkar, S. ; Rasouli, H. ; Tamjidi, S. ; Ming Cai ; Sengupta, Sabyasachi ; Chidambaram, P. ; Thirumala, R. ; Kulkarni, Nandkumar ; Seeram, P. ; Bhadri, P. ; Patel, Pragati ; Sei Seung Yoon ; Terzioglu, E.
Author_Institution
Qualcomm Inc., San Diego, CA, USA
fYear
2013
fDate
4-6 March 2013
Firstpage
580
Lastpage
584
Abstract
Mobile devices spend most of the time in standby mode. Supported features and functionalities are increasing in each newer model. With the wide spread adaptation of multi-tasking in mobile devices, retaining current status and data for all active tasks is critical for user satisfaction. Extending battery life in portable mobile devices necessitates the use of minimum possible energy in standby mode while retaining present states for all active tasks. This paper for the first time, explains the low-voltage data-retention failure mechanism in ops. It analyzes the impact of design and process parameters on the data-retention failure. Statistical nature of data retention failure is established and validated with extensive Monte-Carlo simulations across various process corners. Finally, silicon measurement from several 28nm industrial mobile chips is presented showing good correlation of retention failure prediction from simulation.
Keywords
Monte Carlo methods; elemental semiconductors; flip-flops; low-power electronics; silicon; Monte-Carlo simulations; Si; battery life; low-voltage data-retention failure mechanism; low-voltage flop data retention; mobile chips; portable mobile devices; process technology; silicon correlation; size 28 nm; user satisfaction; CMOS integrated circuits; Correlation; Layout; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-4951-2
Type
conf
DOI
10.1109/ISQED.2013.6523669
Filename
6523669
Link To Document