• DocumentCode
    603040
  • Title

    Improved power hardware in the loop interface methods via impedance matching

  • Author

    Paran, Sanaz ; Edrington, C.S.

  • Author_Institution
    Center for Adv. Power Syst., Florida State Univ., Tallahassee, FL, USA
  • fYear
    2013
  • fDate
    22-24 April 2013
  • Firstpage
    342
  • Lastpage
    346
  • Abstract
    The power hardware in the loop (PHIL) method is a reliable simulation and validation technology. It can be utilized to augment the test of electrical, mechanical or electromechanical components or subsystems with high power ratings. In addition, it can also be used to characterize their behavior when connected to some complex electrical networks or mechanical environment. Reliable and safe performances are paramount in a PHIL system. Thus, the proper PHIL modeling and power interface validation precedes any experimental implementation. In this paper, we focus on the stability and accuracy of the damping impedance method (DIM) and we propose the modified DIM method which increases the accuracy and the stability of the PHIL through dynamic impedance matching of the load and the linking impedance component. Different cases are introduced in order to study the parameters which have effects on the PHIL system. First, the basic DIM method and the modified DIM architecture are introduced, and then two cases consisting of a constant load and a variable load will be presented, respectively.
  • Keywords
    complex networks; impedance matching; power electronics; stability; DIM; PHIL method; complex electrical networks; damping impedance method; dynamic impedance matching; electrical components; electromechanical components; linking impedance component; mechanical environment; power hardware in the loop interface; power interface; stability; Atmospheric modeling; Computational modeling; Computer aided software engineering; Hardware; Resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Ship Technologies Symposium (ESTS), 2013 IEEE
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    978-1-4673-5243-7
  • Type

    conf

  • DOI
    10.1109/ESTS.2013.6523758
  • Filename
    6523758