• DocumentCode
    603460
  • Title

    Fast Recovery Power Epitaxial Diode

  • Author

    Rojas-Hernandez, A.G. ; Vera-Marquina, A. ; Garcia-Juarez, A.

  • Author_Institution
    Dept. de Investig. en Fis., Univ. de Sonora, Hermosillo, Mexico
  • fYear
    2012
  • fDate
    19-23 Nov. 2012
  • Firstpage
    389
  • Lastpage
    394
  • Abstract
    Several diode designs to satisfy specific needs of quick response and power, this paper examines the arguments of a design that is economical in terms of manufacturing process but to improve the requirements of the few devices on the market with these characteristics (reverse breakdown voltage of 600V and reverse recovery time of 35ns). The design is tested using finite elements-through simulation and compared the results with commercial diodes by similar characteristics. The designed structure was p + nn +, with an epitaxial layer 50 mm thick and doped structure 2 × 1014 cm-3, which are obtained breakdown voltages of more than 600V and fast reverse recovery of less than 35 ns. A breakdown voltage of more than 600 V and reverse recovery times less than 35 ns were obtained for a p + nn + structure, with an epilayer of 50 μm thickness and doping of 2 to 3 × 1014 cm-3.
  • Keywords
    finite element analysis; power semiconductor diodes; semiconductor doping; diode designs; doped structure; epitaxial layer; fast recovery power epitaxial diode; fast reverse recovery; finite element simulation; manufacturing process; reverse breakdown voltage; reverse recovery time; size 50 mum; voltage 600 V; Semiconductors; physics semiconductor devices; power diodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Robotics and Automotive Mechanics Conference (CERMA), 2012 IEEE Ninth
  • Conference_Location
    Cuernavaca
  • Print_ISBN
    978-1-4673-5096-9
  • Type

    conf

  • DOI
    10.1109/CERMA.2012.69
  • Filename
    6524611