DocumentCode
603460
Title
Fast Recovery Power Epitaxial Diode
Author
Rojas-Hernandez, A.G. ; Vera-Marquina, A. ; Garcia-Juarez, A.
Author_Institution
Dept. de Investig. en Fis., Univ. de Sonora, Hermosillo, Mexico
fYear
2012
fDate
19-23 Nov. 2012
Firstpage
389
Lastpage
394
Abstract
Several diode designs to satisfy specific needs of quick response and power, this paper examines the arguments of a design that is economical in terms of manufacturing process but to improve the requirements of the few devices on the market with these characteristics (reverse breakdown voltage of 600V and reverse recovery time of 35ns). The design is tested using finite elements-through simulation and compared the results with commercial diodes by similar characteristics. The designed structure was p + nn +, with an epitaxial layer 50 mm thick and doped structure 2 × 1014 cm-3, which are obtained breakdown voltages of more than 600V and fast reverse recovery of less than 35 ns. A breakdown voltage of more than 600 V and reverse recovery times less than 35 ns were obtained for a p + nn + structure, with an epilayer of 50 μm thickness and doping of 2 to 3 × 1014 cm-3.
Keywords
finite element analysis; power semiconductor diodes; semiconductor doping; diode designs; doped structure; epitaxial layer; fast recovery power epitaxial diode; fast reverse recovery; finite element simulation; manufacturing process; reverse breakdown voltage; reverse recovery time; size 50 mum; voltage 600 V; Semiconductors; physics semiconductor devices; power diodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Robotics and Automotive Mechanics Conference (CERMA), 2012 IEEE Ninth
Conference_Location
Cuernavaca
Print_ISBN
978-1-4673-5096-9
Type
conf
DOI
10.1109/CERMA.2012.69
Filename
6524611
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