• DocumentCode
    603476
  • Title

    Fault Ordering for Automatic Test Pattern Generation of Reversible Circuits

  • Author

    Wille, Robert ; Hongyan Zhang ; Drechsler, Rolf

  • Author_Institution
    Inst. of Comput. Sci., Univ. of Bremen, Bremen, Germany
  • fYear
    2013
  • fDate
    22-24 May 2013
  • Firstpage
    29
  • Lastpage
    34
  • Abstract
    Reversible circuits are an attractive computation alternative as they build the basis for many emerging technologies such as quantum computation or low power design. Since first physical realizations of reversible circuits have already been presented in the past, how to efficiently test such circuits became a current research topic. Consequently, several approaches for Automatic Test Pattern Generation (ATPG) have been presented in the past. However, the order in which the respective faults are targeted has a significant effect on the resulting test size. While determining good fault orderings has intensely been considered for the test of conventional circuits, according strategies for reversible circuits have not been evaluated yet. This is done in this paper. To this end, a fault ordering scheme is presented that explicitly exploits the reversibility of the underlying circuits. Experimental results show that the proposed scheme leads to improvements of up to 65% in the size of the testset.
  • Keywords
    automatic test pattern generation; logic circuits; logic design; low-power electronics; network synthesis; ATPG; automatic test pattern generation; fault ordering scheme; low power design; quantum computation; reversible logic circuit; Automatic test pattern generation; Circuit faults; Design automation; Integrated circuit modeling; Logic gates; Quantum computing; Vectors; ATPG; reversible circuits; test;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multiple-Valued Logic (ISMVL), 2013 IEEE 43rd International Symposium on
  • Conference_Location
    Toyama
  • ISSN
    0195-623X
  • Print_ISBN
    978-1-4673-6067-8
  • Electronic_ISBN
    0195-623X
  • Type

    conf

  • DOI
    10.1109/ISMVL.2013.28
  • Filename
    6524635