Considerations of high power electromagnetics (HPEM) transients with respect to Smart Grid

Author

Radasky, William A. ; Koepke, Galen

Author_Institution

Metatech Corp., Goleta, CA, USA

fYear

2013

fDate

9-12 Jan. 2013

Firstpage

1

Lastpage

1

Abstract

As part of the Smart Grid Interoperability Panel (SGIP) work, Electromagnetic Compatibility (EMC) was introduced as an integral process for the design of devices that will be used as part of the Smart Grid. This resulted in the formation of the Electromagnetic Interoperability Issues Working Group (EMII WG). This working group has produced a draft report that evaluates the electromagnetic environment for new electronic devices to be introduced into the Smart Grid of the future. This evaluation is needed to determine if existing EMC immunity standards are available now or whether new standards need to be developed.

Keywords

electromagnetic compatibility; smart power grids; EMC; EMII WG; HPEM Transient; SGIP; electromagnetic compatibility; electromagnetic environment; electromagnetic interoperability issues working group; electronic devices; high power electromagnetic transient; smart grid interoperability panel; Electromagnetic compatibility; Interoperability; Smart grids; Standards; Storms; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Science Meeting (USNC-URSI NRSM), 2013 US National Committee of URSI National

Conference_Location

Boulder, CO

Print_ISBN

978-1-4673-4776-1

Type

conf

DOI

10.1109/USNC-URSI-NRSM.2013.6525041

Filename

6525041