Title :
Respiration Detection Chip With Integrated Temperature-Insensitive MEMS Sensors and CMOS Signal Processing Circuits
Author :
Chia-Ling Wei ; Yu-Chen Lin ; Tse-An Chen ; Ren-Yi Lin ; Tin-Hao Liu
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
An airflow sensing chip, which integrates MEMS sensors with their CMOS signal processing circuits into a single chip, is proposed for respiration detection. Three micro-cantilever-based airflow sensors were designed and fabricated using a 0.35 μm CMOS/MEMS 2P4M mixed-signal polycide process. Two main differences were present among these three designs: they were either metal-covered or metal-free structures, and had either bridge-type or fixed-type reference resistors. The performances of these sensors were measured and compared, including temperature sensitivity and airflow sensitivity. Based on the measured results, the metal-free structure with fixed-type reference resistors is recommended for use, because it has the highest airflow sensitivity and also can effectively reduce the output voltage drift caused by temperature change.
Keywords :
CMOS integrated circuits; bioMEMS; biomedical electronics; biomedical equipment; biomedical measurement; cantilevers; flow sensors; medical signal processing; microfabrication; pneumodynamics; resistors; temperature measurement; temperature sensors; CMOS signal processing circuits; CMOS-MEMS 2P4M mixed-signal polycide process; airflow sensing chip; airflow sensitivity; bridge-type reference resistors; fixed-type reference resistors; integrated temperature-insensitive MEMS sensors; metal-covered structures; metal-free structures; microcantilever-based airflow sensors; output voltage drift; respiration detection chip; size 0.35 mum; temperature sensitivity; CMOS integrated circuits; Immune system; Micromechanical devices; Resistors; Temperature measurement; Temperature sensors; Airflow sensor; CMOS/MEMS; micro-cantilever; respiration; temperature;
Journal_Title :
Biomedical Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TBCAS.2014.2315532