DocumentCode :
604743
Title :
The Impact of Process-Induced Mechanical Stress in Narrow Width Devices and Circuit Design Issues
Author :
Alam, Naushad ; Anand, B. ; Dasgupta, S.
Author_Institution :
Electron. & Comput. Eng. Dept., Indian Inst. of Technol. Roorkee, Roorkee, India
fYear :
2012
fDate :
19-22 Dec. 2012
Firstpage :
213
Lastpage :
215
Abstract :
In this work we present a simulation based study of the impact of process-induced mechanical stress in narrow width devices and its implication on circuit design. We observe that the channel stress and hence drive current of narrow width devices significantly depend upon the actual width of a device. We present a model for estimating width dependent channel stress and effective drive current in strain engineered devices. Width dependent change in drive strength causes WP/WN ratio (also referred to as ´ß´) in inverters to change with inverter scaling factor ´S´. If not accounted for, this results into a suboptimal circuit design. Finally with the help of CMOS tapered buffer design examples we show that assigning ß individually to each stage while considering the narrow width effects (NWE) results into simultaneous improvement in delay, power and silicon area.
Keywords :
CMOS integrated circuits; buffer circuits; stress analysis; CMOS tapered buffer design; NWE; channel stress; circuit design; narrow width effects; process-induced mechanical stress; suboptimal circuit design; width dependent channel stress estimation; CMOS buffers; INWE; STI; TCAD; eSiC; eSiGe; mechanical stress; t/c-ESL;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System Design (ISED), 2012 International Symposium on
Conference_Location :
Kolkata
Print_ISBN :
978-1-4673-4704-4
Type :
conf
DOI :
10.1109/ISED.2012.42
Filename :
6526586
Link To Document :
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