• DocumentCode
    604843
  • Title

    CFD modeling of an existing raised-floor data center

  • Author

    Radmehr, Ali ; Noll, B. ; Fitzpatrick, J. ; Karki, K.

  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    39
  • Lastpage
    44
  • Abstract
    Computational Fluid Dynamics (CFD) modeling is being increasingly used for designing new and analyzing existing data centers. The application of CFD technique for designing new data centers is fairly straightforward since all of the design specifications are available. However, creating an accurate CFD model of an existing data center is often a challenge because some of the required input data is usually not available. The collection of missing details requires survey of the data center and even measurements. In this paper, we present several measurement and modeling techniques that can help the users of CFD technology to create an accurate model of an existing raised-floor data center. These techniques have been implemented in modeling a data center at the University of Rochester in Rochester, NY. To verify the accuracy of the model, calculated values of airflow rates through perforated tiles, rack inlet and exhaust temperatures, and supply and return temperatures for the AC units were compared with the measured values. The agreement is good.
  • Keywords
    computational fluid dynamics; computer centres; exhaust systems; power engineering computing; AC units; CFD modeling; New York; University of Rochester; airflow rates; computational fluid dynamics; exhaust temperatures; perforated tiles; rack inlet; raised-floor data center; return temperatures; supply temperatures; Computational fluid dynamics; Cooling; Data models; Floors; Fluid flow measurement; Heating; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526803
  • Filename
    6526803