• DocumentCode
    604851
  • Title

    Analysis and testing of a thermoelectric heat exchanger configured for cooling a processor module heat load

  • Author

    Campbell, L. ; Wright, L.

  • Author_Institution
    IBM, Poughkeepsie, NY, USA
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    93
  • Lastpage
    98
  • Abstract
    The testing and subsequent data analysis of a liquid to liquid thermoelectric heat exchanger configured to provide cooled water to a heat load are discussed in the following paper. In the test apparatus, water flow rates and temperatures are recorded. From previously obtained heat transfer data for each heat exchanger plate, and from previous thermoelectric heat exchanger analysis work by Campbell et al. [1] and Luo [2], a model is developed and fit to the current data. Various scenarios are then developed to explore the performance of the thermoelectric heat exchanger in multiple operating modes.
  • Keywords
    data analysis; heat exchangers; thermoelectric cooling; cooling; data analysis; liquid to liquid thermoelectric heat exchanger; multiple operating modes; processor module heat load; water flow rates; Cold plates; Equations; Heat pumps; Mathematical model; Water heating; Thermoelectric; heat exchanger;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526811
  • Filename
    6526811