DocumentCode
604851
Title
Analysis and testing of a thermoelectric heat exchanger configured for cooling a processor module heat load
Author
Campbell, L. ; Wright, L.
Author_Institution
IBM, Poughkeepsie, NY, USA
fYear
2013
fDate
17-21 March 2013
Firstpage
93
Lastpage
98
Abstract
The testing and subsequent data analysis of a liquid to liquid thermoelectric heat exchanger configured to provide cooled water to a heat load are discussed in the following paper. In the test apparatus, water flow rates and temperatures are recorded. From previously obtained heat transfer data for each heat exchanger plate, and from previous thermoelectric heat exchanger analysis work by Campbell et al. [1] and Luo [2], a model is developed and fit to the current data. Various scenarios are then developed to explore the performance of the thermoelectric heat exchanger in multiple operating modes.
Keywords
data analysis; heat exchangers; thermoelectric cooling; cooling; data analysis; liquid to liquid thermoelectric heat exchanger; multiple operating modes; processor module heat load; water flow rates; Cold plates; Equations; Heat pumps; Mathematical model; Water heating; Thermoelectric; heat exchanger;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-6427-0
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/SEMI-THERM.2013.6526811
Filename
6526811
Link To Document