• DocumentCode
    604854
  • Title

    Investigation of a multiple-vibrating fan system for electronics cooling

  • Author

    Su, H.C. ; Liu, C.L. ; Pan, T.J. ; Ma, H.K.

  • Author_Institution
    Dept. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    110
  • Lastpage
    115
  • Abstract
    The previous study presented a novel multiple-vibrating fan cooling system actuated by both the piezoelectric (PZT) effect and magnetic force. The thermal performance of the system was demonstrated by checking the temperature drop of the thermocouples adhered to the fin surface. In this study, the convection heat transfer coefficient of an internal multiple-vibrating fan cooling system was calculated by simulation model to verify the accuracy of the theoretical model. Furthermore, the applications of multiple-vibrating fan cooling systems were demonstrated by an external multiple-vibrating fan cooling system, and a T-shape multiple-vibrating fan cooling system. The experimental result showed that the external multiple-vibrating fan cooling system consuming 0.086W, and was able to decrease the core temperature of dummy heater B dissipating 25W from 110.1°C to 80.5°C while the ambient temperature was 27.4°C. The T-shape multiple-vibrating fan cooling system consuming 0.15W, was able to decrease the core temperature of dummy heater B dissipating 25W from 86.9°C to 55.6°C while the ambient temperature was 27.4°C.
  • Keywords
    convection; cooling; fans; piezoelectric actuators; piezoelectricity; thermocouples; vibrations; PZT effect; T-shape multiple-vibrating fan cooling system; convection heat transfer coefficient; dummy heater; external multiple-vibrating fan cooling system; fin surface; internal multiple-vibrating fan cooling system; magnetic force; multiple-vibrating fan system; piezoelectric effect; power 0.086 W; power 0.15 W; power 25 W; temperature 110.1 degC to 80.5 degC; temperature 27.4 degC; temperature 86.9 degC to 55.6 degC; temperature drop; thermal performance; thermocouples; Equations; Fans; Heat sinks; Heat transfer; Heating; Mathematical model; convection; cooling; piezoelectric fan;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526814
  • Filename
    6526814