DocumentCode
604861
Title
An experimental study on applying miniature loop heat pipes for laptop PC cooling
Author
Lin, Z.R. ; Lin, W.Z. ; Zhang, L.W. ; Wang, S.F.
Author_Institution
Novark Technol. Inc., Shenzhen, China
fYear
2013
fDate
17-21 March 2013
Firstpage
154
Lastpage
158
Abstract
A novel miniature flat loop heat pipes (MFLHPs) with rectangular shaped evaporator was developed and designed for laptop cooling, by considering the operating principle of the LHP system and its ability to carry larger amounts of heat over long distances than conventional heat pipes. The effect of the length of the evaporator and the connecting pipe was investigated. The results showed that the length of the connecting pipe and the length of the evaporator are the main factors affecting MFLHP start-up. The thermal performance of a MFLHP increased with the increase of the length of the evaporator. There was an optimal length of the connecting pipe to make a MFLHP operating well. Finally, a heat sink attached to a MFLHP was developed for cooling a CPU of notebook, the thermal design power (TDP) of which was 45W. The results showed the CPU heat sink with MFLHP had good performance and satisfied laptop cooling requirements. Compared to the conventional heat pipe solutions, the MFLHP solution was able to keep CPU temperature stable with the increase of heat loads and cope with the higher power dissipation, offering the potential to make a lighter heat sink.
Keywords
cooling; heat pipes; heat sinks; laptop computers; notebook computers; thermal management (packaging); CPU; MFLHP; TDP; connecting pipe; heat sink; laptop PC cooling; miniature flat loop heat pipes; notebook; optimal length; power 45 W; power dissipation; rectangular shaped evaporator; thermal design power; Heat sinks; Heating; Joining processes; Pipelines; Portable computers; Thermal resistance; Heat Transfer Characteristics; Laptop PC cooling; Miniature flat loop heat pipe; length of the evaporator; the connecting pipe;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4673-6427-0
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/SEMI-THERM.2013.6526821
Filename
6526821
Link To Document