• DocumentCode
    604861
  • Title

    An experimental study on applying miniature loop heat pipes for laptop PC cooling

  • Author

    Lin, Z.R. ; Lin, W.Z. ; Zhang, L.W. ; Wang, S.F.

  • Author_Institution
    Novark Technol. Inc., Shenzhen, China
  • fYear
    2013
  • fDate
    17-21 March 2013
  • Firstpage
    154
  • Lastpage
    158
  • Abstract
    A novel miniature flat loop heat pipes (MFLHPs) with rectangular shaped evaporator was developed and designed for laptop cooling, by considering the operating principle of the LHP system and its ability to carry larger amounts of heat over long distances than conventional heat pipes. The effect of the length of the evaporator and the connecting pipe was investigated. The results showed that the length of the connecting pipe and the length of the evaporator are the main factors affecting MFLHP start-up. The thermal performance of a MFLHP increased with the increase of the length of the evaporator. There was an optimal length of the connecting pipe to make a MFLHP operating well. Finally, a heat sink attached to a MFLHP was developed for cooling a CPU of notebook, the thermal design power (TDP) of which was 45W. The results showed the CPU heat sink with MFLHP had good performance and satisfied laptop cooling requirements. Compared to the conventional heat pipe solutions, the MFLHP solution was able to keep CPU temperature stable with the increase of heat loads and cope with the higher power dissipation, offering the potential to make a lighter heat sink.
  • Keywords
    cooling; heat pipes; heat sinks; laptop computers; notebook computers; thermal management (packaging); CPU; MFLHP; TDP; connecting pipe; heat sink; laptop PC cooling; miniature flat loop heat pipes; notebook; optimal length; power 45 W; power dissipation; rectangular shaped evaporator; thermal design power; Heat sinks; Heating; Joining processes; Pipelines; Portable computers; Thermal resistance; Heat Transfer Characteristics; Laptop PC cooling; Miniature flat loop heat pipe; length of the evaporator; the connecting pipe;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4673-6427-0
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/SEMI-THERM.2013.6526821
  • Filename
    6526821