Title :
Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Vairavan, Rajendaran ; Haimi, W.M.W.N. ; Kamarudin, H. ; Neoh Fung Yih ; Khalid, N.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
LEDs are being utilized as lighting source due to its superior advantages over incandescent lamps in terms of higher efficiency, brighter light emission and longer lifetime. However, the reliability and efficiency of the LED is dependent on the junction temperature of the LED chip. Hence, the heat dissipation of single chip LED package with aluminum heat slug was investigated through simulation in this study .The heat dissipation was evaluated in terms of junction temperature. The single chip LED was powered with input power of 0.1W and 1W. The Von Mises stress of the LED chip at both input power was evaluated. The maximum junction temperature of the LED at steady state is 119.43°C at input power of 1W.
Keywords :
LED lamps; aluminium; cooling; electronics packaging; filament lamps; lighting; semiconductor device reliability; Al; LED chip; Von Mises stress; aluminum heat slug; heat dissipation; incandescent lamps; junction temperature; lighting source; reliability; single chip LED package; solid state lighting stress; temperature 119.43 degC; Electronic packaging thermal management; Heating; Junctions; Light emitting diodes; Reliability; Steady-state; Stress; single chip LED; aluminum heat slug; junction temperature; ansys;
Conference_Titel :
Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4673-6421-8
DOI :
10.1109/UKSim.2013.127
