Title :
Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Aziz, M.H.A. ; Say, O.T. ; Kamarudin, H. ; Theren, D.R. ; Man, B.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
Shear height has substantial effect on the solder ball shear strength. In recent times, taking environmental issue into consideration, Lead free solder joint must be developed. In this paper, the load effect of different shear heights with fixed shear speed of a single solder joint on Ball Grid Array (BGA) is presented through simulation. A Lead free material, Sn-3.9Ag-0.6Cu was adopted as solder ball attachment. The effect of dynamic stress response on a single solder joint was simulated using Ansys version 11. The results from the plotted graph showed that shear force reduced with the increasing of shear ram height.
Keywords :
ball grid arrays; solders; Ansys version 11; SSF method; ball grid array; dynamic stress response; fixed shear speed; lead free material; lead free solder joint; shear force; shear height analysis; shear ram height; single solder joint; solder ball attachment; solder ball shear strength; Analytical models; Computational modeling; Finite element analysis; Materials; Soldering; Strain; Stress; Ball Grid Array (BGA); shear test; shear speed; shear height; simple single factor (SSF);
Conference_Titel :
Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4673-6421-8
DOI :
10.1109/UKSim.2013.129
