Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder

Author

Retnasamy, Vithyacharan ; Sauli, Zaliman ; Nor, N.I.M. ; Palianysamy, M. ; Ismail, R.C. ; Say, O.T. ; Kamarudin, H.

Author_Institution

Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia

fYear

2013

fDate

10-12 April 2013

Firstpage

317

Lastpage

320

Abstract

Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single solder joint with varied parameters are briefly discussed. A suitable lead-free solder is used in this study which is Sn-3.5Ag-0.7Cu. Simple Single Factor (SSF) method was used to execute this experimental study. Ansys software was used to simulate and investigate the stress response on a single solder ball joints. The results shows that when the shear height is high the shear stress is reduced.

Keywords

ball grid arrays; integrated circuit interconnections; reflow soldering; solders; surface mount technology; BGA; ball grid array; integrated circuits; interconnection technology; lead free solder; shear height stress evaluation; solder reflow; surface mount chip package; surface mount technology; Computational modeling; Metals; Plastics; Soldering; Strain; Stress; Ball Grid Array (BGA); lead-free solder alloy; shear test; miniature solder joint;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on

Conference_Location

Cambridge

Print_ISBN

978-1-4673-6421-8

Type

conf

DOI

10.1109/UKSim.2013.130

Filename

6527436