Title :
Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder
Author :
Retnasamy, Vithyacharan ; Sauli, Zaliman ; Nor, N.I.M. ; Palianysamy, M. ; Ismail, R.C. ; Say, O.T. ; Kamarudin, H.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
Interconnection technology has improved by leaps and bounds since the advent of solder reflow. This has made surface mount technology more robust. Ball Grid Array (BGA) is a demanding surface mount chip package in Integrated Circuits (IC) which uses a grid of solder balls as its connectors. In this preliminary study, load effects of shear test on a single solder joint with varied parameters are briefly discussed. A suitable lead-free solder is used in this study which is Sn-3.5Ag-0.7Cu. Simple Single Factor (SSF) method was used to execute this experimental study. Ansys software was used to simulate and investigate the stress response on a single solder ball joints. The results shows that when the shear height is high the shear stress is reduced.
Keywords :
ball grid arrays; integrated circuit interconnections; reflow soldering; solders; surface mount technology; BGA; ball grid array; integrated circuits; interconnection technology; lead free solder; shear height stress evaluation; solder reflow; surface mount chip package; surface mount technology; Computational modeling; Metals; Plastics; Soldering; Strain; Stress; Ball Grid Array (BGA); lead-free solder alloy; shear test; miniature solder joint;
Conference_Titel :
Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4673-6421-8
DOI :
10.1109/UKSim.2013.130
