Title :
Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Ong Tee Say ; Taniselass, Steven ; Ismail, R.C. ; Yeow, A.K.T. ; Kamarudin, H.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
The reliability of the solder joints of Ball Grid Array is severely tested during the exposure of thermal operation due to coefficient of thermal expansion (CTE). Different thermal expansion due to this mismatch causes shearing effects to the solder joints. This paper compares the shearing speed on stress and strain between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu solder ball. A full factorial design of experiment was used to compute the interactions between the factors on each response using a finite element analysis software, Ansys. It is found out that Sn-3.5Ag-0.7Cu solder ball contributes higher stress. On the other hand, Von-Mises stress and equivalent plastic strain increases in parallel with the increasing of the shear speed.
Keywords :
ball grid arrays; design of experiments; finite element analysis; plastic deformation; reliability; semiconductor industry; silver alloys; solders; stress-strain relations; thermal expansion; tin alloys; Ansys; CTE; SnAgCu; Von-Mises stress; ball grid array; coefficient-of-thermal expansion; equivalent plastic strain; finite element analysis software; full factorial design of experiment; reliability; shear speed; shearing speed stress comparison; solder ball; solder joints; stress-strain behavior; Finite element analysis; Plastics; Shearing; Soldering; Strain; Stress; Ball Grid Array; shear speed; ANSYS; Sn-3.5Ag-0.7Cu; 3.9Ag-0.6Cu; CTE mismatch;
Conference_Titel :
Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on
Conference_Location :
Cambridge
Print_ISBN :
978-1-4673-6421-8
DOI :
10.1109/UKSim.2013.131
