Title :
A novel silicon interposer for measuring devices requiring complex two-sided contacting
Author :
Derakhshandeh, J. ; Golshani, Negin ; Steenweg, L.A. ; van der Vlist, W. ; Nanver, Lis K.
Author_Institution :
DIMES, Delft Univ. of Technol., Delft, Netherlands
Abstract :
The design and fabrication process is presented for a novel silicon-based interposer suitable for dies where it is necessary to place multiple contact pads on the both sides of wafer. This interposer transfers all contacts to the same side of the wafer so that the measurement can be done using conventional probe stations for one-sided probing.
Keywords :
electrical contacts; elemental semiconductors; integrated circuit packaging; photodetectors; photodiodes; probes; silicon; Si; complex two-sided contacting; fabrication process; measuring devices; multiple contact pads; one-sided probing; photodiode detector; probe stations; silicon interposer; wafer; Contacts; Electric variables measurement; Etching; Layout; Probes; Silicon; Wires; Double sided probing; Photodiode detector; Silicon DRIE; Silicon interposer;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
978-1-4673-4845-4
Electronic_ISBN :
1071-9032
DOI :
10.1109/ICMTS.2013.6528143
