Title :
Newly developed Test-Element-Group for detecting soft failures of the low-resistance-element using doubly nesting array
Author :
Sato, Seiki ; Shinkawata, H. ; Tsuda, A. ; Yoshizawa, T. ; Ohno, Tetsufumi
Author_Institution :
Devices & Anal. Technol. Div., Renesas Electron. Corp., Itami, Japan
Abstract :
We report newly developed Test-Element-Group for detecting soft failures of low-resistance-element like interconnect via using doubly nesting array. We detected the soft failure of fine via which resistance had about 10 times larger resistance than normal via using this structure manufactured in 40nm CMOS technology.
Keywords :
CMOS integrated circuits; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; CMOS technology; doubly nesting array; low-resistance-element like interconnect; size 40 nm; soft failure detection; test-element-group; Arrays; Electrical resistance measurement; Metals; Microprocessors; Resistance; Resistors; Back End Of Line; array structure; interconnect via; soft failure; variability; yield;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
Conference_Location :
Osaka, Japan
Print_ISBN :
978-1-4673-4845-4
Electronic_ISBN :
1071-9032
DOI :
10.1109/ICMTS.2013.6528152
