• DocumentCode
    605528
  • Title

    Newly developed Test-Element-Group for detecting soft failures of the low-resistance-element using doubly nesting array

  • Author

    Sato, Seiki ; Shinkawata, H. ; Tsuda, A. ; Yoshizawa, T. ; Ohno, Tetsufumi

  • Author_Institution
    Devices & Anal. Technol. Div., Renesas Electron. Corp., Itami, Japan
  • fYear
    2013
  • fDate
    25-28 March 2013
  • Firstpage
    95
  • Lastpage
    98
  • Abstract
    We report newly developed Test-Element-Group for detecting soft failures of low-resistance-element like interconnect via using doubly nesting array. We detected the soft failure of fine via which resistance had about 10 times larger resistance than normal via using this structure manufactured in 40nm CMOS technology.
  • Keywords
    CMOS integrated circuits; failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; CMOS technology; doubly nesting array; low-resistance-element like interconnect; size 40 nm; soft failure detection; test-element-group; Arrays; Electrical resistance measurement; Metals; Microprocessors; Resistance; Resistors; Back End Of Line; array structure; interconnect via; soft failure; variability; yield;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures (ICMTS), 2013 IEEE International Conference on
  • Conference_Location
    Osaka, Japan
  • ISSN
    1071-9032
  • Print_ISBN
    978-1-4673-4845-4
  • Electronic_ISBN
    1071-9032
  • Type

    conf

  • DOI
    10.1109/ICMTS.2013.6528152
  • Filename
    6528152
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=605528